The aim of SINTEC is to advance a rigid-stretch PCB technology with stretchable substrate and liquid alloy, and to demonstrate its usability in complex applications, involving wearable sensing, embedded processing, and Fat-IBC. This will substantiate the advantages with this rigid-stretch technology and its improvement area. Industrial manufacturability and cost/scaling issues will be investigated.
Its unique features will enable a ground breaking intra body communication technique that provides secure communication at large bandwidth and low power, allowing for multiplex sensoric inputs from many sensor nodes on the body.
Our vision is that with its dynamic compliance and water repellent permeable encapsulation the soft, sticky and stretchable smart patch will withstand vigorous action, sweating and water; making it ideal for an active life.